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SiGe, High-Linearity, 2300MHz to 4000MHz
Upconversion/Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V CC to GND..........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS to GND .......................... -0.3V to (V CC + 0.3V)
RF, LO Input Power ....................................................... +20dBm
RF, LO Current (RF and LO is DC shorted
to GND through a balun)................................... .............50mA
Continuous Power Dissipation (Note 1) .................................5W
B JC (Notes 1, 3) ............................................................ +13 N C/W
Operating Case Temperature
Range (Note 4) ..................................... T C = -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
B JA (Notes 2, 3) ............................................................ +38 N C/W
Note 1: Based on junction temperature T J = T C + ( B JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150 N C.
Note 2: Junction temperature T J = T A + ( B JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit , V CC = 4.75V to 5.25V, no input RF or LO signals. T C = -40 N C to +85 N C, unless otherwise noted. Typical
values are at V CC = 5.0V, T C = +2 5 N C, all parameters are production tested.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V CC
I CC
CONDITIONS
MIN
4.75
TYP
5.0
138
MAX
5.25
155
UNITS
V
mA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit , V CC = 3.0V to 3.6V, no input RF or LO signals. T C = -40 N C to +85 N C, unless otherwise noted. Typical
values are at V CC = 3.3V, T C = +25 N C, parameters are guaranteed by design, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
V CC
I CC
Total supply current, V CC = 3.3V
3.0
3.3
121
3.6
135
V
mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Typical Application Circuit with C1 = 3.3nH
and C12 = 0.3pF, see Table 1 for details
2300
3000
RF Frequency Range
f RF
(Note 5)
Typical Application Circuit with C1 = 8.2pF
and C12 not installed, see Table 1 for
3000
4000
MHz
details (Note 5)
LO Frequency
f LO
(Note 5)
2600
4300
MHz
Using an M/A-Com MABAES0029 1:1
transformer as defined in the Typical
IF Frequency
f IF
Application Circuit , IF matching
50
500
MHz
components affect the IF frequency range
(Note 5)
LO Drive
P LO
(Note 5)
-3
0
+3
dBm
2
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